Solder paste - メーカー・企業と製品の一覧 | イプロス

Solder pasteの製品一覧

1～3 件を表示 ／ 全 3 件

表示件数
McDermid: Introduction to Low Melting Point Solder Paste

McDermid: Introduction to Low Melting Point Solder Paste

Reduce the incidence of HIP and NWO defects! Features of low melting point solder paste are included.

In this document, we introduce "Low Melting Point Solder Paste." It includes sections on "Features of Low Melting Point Solder Paste and Total Cost Reduction" and "Introduction to the Bulk Reflow Process (Paste in Hole: P.I.H)." Additionally, we explain "Drop Impact Resistance Comparison Data" using graphs. Please feel free to download and take a look. 【Contents】 ■ Features of Low Melting Point Solder Paste and Total Cost Reduction ■ Introduction to the Bulk Reflow Process (Paste in Hole: P.I.H) ■ Details of the P.I.H Process ■ Product Lineup Introduction / Drop Impact Resistance Comparison Data ■ Summary *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Solder paste

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
McDermid Solder Paste "HRL1 OM-550"

McDermid Solder Paste "HRL1 OM-550"

This is a non-eutectic low melting point solder paste for low thermal resistance substrates, components, and large warping semiconductor parts!

"HRL1 OM-550" is a low-melting-point solder paste. It is designed to improve yield and reduce component warpage, significantly enhancing the drop shock resistance and thermal cycle resistance, which were weaknesses of conventional low-melting-point solder. The melting point is significantly lower compared to "SAC305," achieving energy savings in the assembly process by lowering the peak temperature during reflow from 245°C to 185°C. [Features] - Board life: Continuous printing possible for up to 12 hours - Achieves low voids with various packages such as BGA, MLF, and DPAK - Dramatically improves macro (H.I.P) defects and NWO (Non-Wet Open) defects through low-melting-point reflow - Compatible with both air and N2 reflow - Adaptable to components using SAC305 alloy *For more details, please refer to the PDF document or feel free to contact us.

  • Special Construction Method
  • Solder paste

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
McDermid Solder Paste "ULT1 OM-220"

McDermid Solder Paste "ULT1 OM-220"

It is suitable for various applications, such as products where substrates and components with low heat resistance may be implemented!

The solder paste "ULT1 OM-220" is a super low melting point product developed for mounting on substrates and components with low heat resistance. It allows for mounting at a peak temperature of 150°C or lower during reflow, enabling secondary mounting without re-melting the boards that have been mounted with "SAC305." This product is suitable for various applications, including consumer electronics, in-cabin automotive products, and medical products, where there is a possibility of mounting on substrates and components with low heat resistance. 【Features】 ■ Peak temperature during reflow: 150°C or lower ■ Mounting of low-cost substrates and components ■ Reduction of warpage of substrates and components during mounting <Compared to SAC (Sn/Ag/Cu) solder> ■ Excellent electrical reliability (cleared JIS Z 3197 and J-STD-0004B surface insulation resistance tests) ■ Low voids (satisfies IPC-7095 Class 3: BGA) *For more details, please refer to the PDF document or feel free to contact us.

  • Special Construction Method
  • Solder paste

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Solder pasteの関連カテゴリ

COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.